DocumentCode
1071802
Title
Diagnosis of a cause of life test failure in alloy diodes
Author
Kingsnorth, Roland
Author_Institution
Mullard Ltd., Southampton, Hampshire, United Kingdom
Volume
27
Issue
12
fYear
1980
fDate
12/1/1980 12:00:00 AM
Firstpage
2312
Lastpage
2316
Abstract
Removal of silicon by CF4 /O2 plasma etching combined with optical microscope and SEM examinations of the exposed aluminum surface have been used to determine that the cause of life test failure in aluminum/silicon-alloy diodes was the presence of traces of alkali metal in the aluminum pellets used.
Keywords
Aluminum; Circuit testing; Electron devices; Life testing; Optical distortion; Scanning electron microscopy; Semiconductor device testing; Semiconductor diodes; Silicon; Solid state circuits;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1980.20271
Filename
1481063
Link To Document