DocumentCode
1073399
Title
Interconnection reliability
Author
Reagor, Barbara T.
Author_Institution
Bellcore, Red Bank, NJ, USA
Volume
11
Issue
4
fYear
1988
fDate
12/1/1988 12:00:00 AM
Firstpage
390
Lastpage
392
Abstract
Presents a summary of some of the key features that can affect interconnection reliability. In particular, addresses how manufacturing contamination, materials selection, lubrication, and environmental protection affect all levels of interconnection. The information is documented through discussion of actual field failures
Keywords
environmental testing; failure analysis; lubrication; reliability; environmental protection; field failures; interconnection reliability; lubrication; manufacturing contamination; materials selection; Communication industry; Contamination; Digital systems; Manufacturing; Packaging; Protection; Semiconductor device manufacture; Stability; Switches; Wire;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.16672
Filename
16672
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