• DocumentCode
    1078456
  • Title

    Circuit models for power bus structures on printed circuit boards using a hybrid FEM-SPICE method

  • Author

    Guo, Chunlei ; Hubing, Todd H.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Missouri-Rolla, Rolla, MO
  • Volume
    29
  • Issue
    3
  • fYear
    2006
  • Firstpage
    441
  • Lastpage
    447
  • Abstract
    Power bus structures consisting of two parallel conducting planes are widely used on high-speed printed circuit boards. In this paper, a full-wave finite-element method (FEM) method is used to analyze power bus structures, and the resulting matrix equations are converted to equivalent circuits that can be analyzed using SPICE programs. Using this method of combining FEM and SPICE, power bus structures of arbitrary shape can be modeled efficiently both in the time-domain and frequency-domain, along with the circuit components connected to the bus. Dielectric loss and losses due to the finite resistance of the power planes can also be modeled. Practical examples are presented to validate this method
  • Keywords
    SPICE; finite element analysis; frequency-domain analysis; power electronics; printed circuits; time-domain analysis; SPICE analysis; circuit component; circuit models; dielectric loss; equivalent circuits; finite resistance loss; frequency-domain modeling; full-wave finite-element method; hybrid FEM-SPICE method; power bus structures; printed circuit boards; time-domain modeling; Dielectric losses; Equations; Equivalent circuits; Finite element methods; Matrix converters; Printed circuits; SPICE; Shape; Time domain analysis; Transmission line matrix methods; Finite-element method (FEM); SPICE; modeling;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2006.875089
  • Filename
    1667862