DocumentCode
1078456
Title
Circuit models for power bus structures on printed circuit boards using a hybrid FEM-SPICE method
Author
Guo, Chunlei ; Hubing, Todd H.
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Missouri-Rolla, Rolla, MO
Volume
29
Issue
3
fYear
2006
Firstpage
441
Lastpage
447
Abstract
Power bus structures consisting of two parallel conducting planes are widely used on high-speed printed circuit boards. In this paper, a full-wave finite-element method (FEM) method is used to analyze power bus structures, and the resulting matrix equations are converted to equivalent circuits that can be analyzed using SPICE programs. Using this method of combining FEM and SPICE, power bus structures of arbitrary shape can be modeled efficiently both in the time-domain and frequency-domain, along with the circuit components connected to the bus. Dielectric loss and losses due to the finite resistance of the power planes can also be modeled. Practical examples are presented to validate this method
Keywords
SPICE; finite element analysis; frequency-domain analysis; power electronics; printed circuits; time-domain analysis; SPICE analysis; circuit component; circuit models; dielectric loss; equivalent circuits; finite resistance loss; frequency-domain modeling; full-wave finite-element method; hybrid FEM-SPICE method; power bus structures; printed circuit boards; time-domain modeling; Dielectric losses; Equations; Equivalent circuits; Finite element methods; Matrix converters; Printed circuits; SPICE; Shape; Time domain analysis; Transmission line matrix methods; Finite-element method (FEM); SPICE; modeling;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2006.875089
Filename
1667862
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