• DocumentCode
    1079249
  • Title

    Development of high-power electromagnetic (HPEM) standards

  • Author

    Wik, Manuel W. ; Radasky, William A.

  • Author_Institution
    Defence Materiel Adm., Sweden
  • Volume
    46
  • Issue
    3
  • fYear
    2004
  • Firstpage
    439
  • Lastpage
    445
  • Abstract
    The International Electrotechnical Commission (IEC) is the authority for world standards in electrical and electronics engineering. The IEC technical subcommittee 77C "High-power transient phenomena" of technical committee 77 "Electromagnetic compatibility" is preparing standards and technical reports on immunity to high-altitude electromagnetic pulse (HEMP) and currently to all categories of intentional electromagnetic interference (IEMI). A short description is given of the IEC main objective, management, and organization of technical work. An overview is given of the subcommittee 77C structure, management, objectives, and sources. At present, the work comprises 17 projects of which 14 have been published. The publications and projects are discussed under the following main parts: general, environment, testing and measurement techniques, installation and mitigation guidelines, and generic standards.
  • Keywords
    IEC standards; electromagnetic compatibility; electromagnetic interference; electromagnetic pulse; transients; IEC standard; International Electrotechnical Commission; electrical engineering; electromagnetic compatibility; electronics engineering; high-altitude electromagnetic pulse; high-power electromagnetic standard; high-power transient phenomena; intentional electromagnetic interference; EMP radiation effects; Electromagnetic compatibility; Electromagnetic compatibility and interference; Electromagnetic transients; Guidelines; IEC standards; Immunity testing; Measurement techniques; Standards development; Writing; Electromagnetic interference; measurement; pulse power systems; standardization; transient response;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2004.831895
  • Filename
    1325799