DocumentCode
108054
Title
Modeling and Characterization of a Vernier Latching MEMS Variable Optical Attenuator
Author
Unamuno, Anartz ; Blue, Robert ; Uttamchandani, Deepak
Author_Institution
Centre for Microsyst. & Photonics, Univ. of Strathclyde, Glasgow, UK
Volume
22
Issue
5
fYear
2013
fDate
Oct. 2013
Firstpage
1229
Lastpage
1241
Abstract
We report on the modeling and testing of a Vernier latched MEMS variable optical attenuator (VOA) which uses chevron electrothermal microactuators to control fiber-to-fiber optical power coupling. The use of microlatches has the advantage of holding the mechanical position of the fiber, and therefore the level of attenuation, with no electrical energy supplied except only to change the attenuation. Results of analytical electro-thermo-mechanical models of the device are obtained and compared with experimental test results, showing a good agreement. A step resolution of 0.5 μm for this multi-state latched device is achieved using a Vernier latch approach. This incremental step size is smaller than previously reported latched microactuators. The VOA demonstrated an attenuation range of over 47 dB and an insertion loss of 1 dB. The wavelength dependent loss across the optical communications C-band is 1.4 dB at 40 dB attenuation and the 10-90% transition time of the unlatched VOA is measured to be 1.7 ms.
Keywords
flip-flops; micro-optomechanical devices; microactuators; optical attenuators; optical communication equipment; optical fibre communication; optical fibre losses; optical testing; MEMS VOA; Vernier latch method; Vernier latching MEMS variable optical attenuator; chevron electrothermal microactuators; electrothermomechanical models; fiber-to-fiber optical power coupling; insertion loss; mechanical position; microlatches; multistate latched device; optical attenuation; optical communication C-band; optical testing; transition time; wavelength dependent loss; Chevron microactuators; Variable optical attenuator; Vernier-latch; electro-thermal actuators; fiber-to-fiber coupling;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2013.2262593
Filename
6541949
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