• DocumentCode
    108223
  • Title

    Modeling Injection of Electrical Fast Transients Into Power and IO Pins of ICs

  • Author

    Ji Zhang ; Jayong Koo ; Moseley, Richard ; Herrin, Scott ; Xiang Li ; Pommerenke, David ; Beetner, Daryl G.

  • Author_Institution
    Cisco Syst., Inc., San Jose, CA, USA
  • Volume
    56
  • Issue
    6
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    1576
  • Lastpage
    1584
  • Abstract
    A SPICE-based model of a microcontroller was developed to investigate its immunity to electrical fast transients (EFTs). The model includes representations of the on-die power delivery network, the ESD protection clamps, and the I/O driver circuits. Several measurement approaches were developed to characterize the linear and nonlinear components within the model. EFTs were injected into pins of the microcontroller to verify the accuracy of the proposed model. General purpose I/O were tested in several configurations (i.e., pull-up-enabled input, logical-high output, and logical-low output). The model was able to predict the voltage waveform and maximum voltage at each pin within 5~6% of the measured values. A parasitic bipolar junction transistor associated with the output driver was found to have a critical impact on the noise coupled to the power bus. The simplicity and accuracy of this model shows its promise for understanding and predicting immunity issues in integrated circuits.
  • Keywords
    SPICE; driver circuits; electrostatic discharge; integrated circuit modelling; microcontrollers; EFTs; ESD protection clamps; I/O driver circuits; ICs; IO pins; SPICE-based model; electrical fast transient modeling injection; integrated circuits; linear components; measurement approach; microcontroller; nonlinear components; on-die power delivery network; parasitic bipolar junction transistor; power bus; voltage waveform prediction; Electrostatic discharges; Immunity testing; Integrated circuit modeling; SPICE; Solid modeling; Voltage measurement; Electromagnetic interference; integrated circuit (IC) design; measurement; modeling; power distribution;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2014.2332499
  • Filename
    6863668