DocumentCode
108223
Title
Modeling Injection of Electrical Fast Transients Into Power and IO Pins of ICs
Author
Ji Zhang ; Jayong Koo ; Moseley, Richard ; Herrin, Scott ; Xiang Li ; Pommerenke, David ; Beetner, Daryl G.
Author_Institution
Cisco Syst., Inc., San Jose, CA, USA
Volume
56
Issue
6
fYear
2014
fDate
Dec. 2014
Firstpage
1576
Lastpage
1584
Abstract
A SPICE-based model of a microcontroller was developed to investigate its immunity to electrical fast transients (EFTs). The model includes representations of the on-die power delivery network, the ESD protection clamps, and the I/O driver circuits. Several measurement approaches were developed to characterize the linear and nonlinear components within the model. EFTs were injected into pins of the microcontroller to verify the accuracy of the proposed model. General purpose I/O were tested in several configurations (i.e., pull-up-enabled input, logical-high output, and logical-low output). The model was able to predict the voltage waveform and maximum voltage at each pin within 5~6% of the measured values. A parasitic bipolar junction transistor associated with the output driver was found to have a critical impact on the noise coupled to the power bus. The simplicity and accuracy of this model shows its promise for understanding and predicting immunity issues in integrated circuits.
Keywords
SPICE; driver circuits; electrostatic discharge; integrated circuit modelling; microcontrollers; EFTs; ESD protection clamps; I/O driver circuits; ICs; IO pins; SPICE-based model; electrical fast transient modeling injection; integrated circuits; linear components; measurement approach; microcontroller; nonlinear components; on-die power delivery network; parasitic bipolar junction transistor; power bus; voltage waveform prediction; Electrostatic discharges; Immunity testing; Integrated circuit modeling; SPICE; Solid modeling; Voltage measurement; Electromagnetic interference; integrated circuit (IC) design; measurement; modeling; power distribution;
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/TEMC.2014.2332499
Filename
6863668
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