DocumentCode
1082879
Title
In0.53 Ga0.47 As FET´s with insulator-assisted Schottky gates
Author
O´Connor, P. ; Pearsall, T.P. ; Cheng, K.Y. ; Cho, A.Y. ; Hwang, J.C.M. ; Alavi, K.
Author_Institution
Bell Laboratories, Murray Hill, NJ
Volume
3
Issue
3
fYear
1982
fDate
3/1/1982 12:00:00 AM
Firstpage
64
Lastpage
66
Abstract
Schottky-gate FET´s have been fabricated on n-type In0.53 Ga0.47 As using a thin interfacial silicon nitride layer between the metal and the epitaxial layer to reduce the gate leakage current. In0.53 Ga0.47 As was grown by molecular beam epitaxy on semi-insulating InP substrates and silicon nitride was grown by plasma-enhanced chemical vapor deposition. Devices with 1.2µm gate length and net donor doping in the mid 1016cm-3range show dc transconductance of up to 130mS/mm. Both depletion and enhancement mode operation were observed. The effective saturation velocity of electrons in the channel is deduced to be 2.0 ± 0.5 × 107cm/sec, a value 60 to 70% higher than that in GaAs MESFET´s. The insulator-assisted gate technology has many advantages in fabrication flexibility and control compared with other approaches to realizing high-speed microwave and logic in FET´s in In0.53 Ga0.47 As.
Keywords
Chemical vapor deposition; Epitaxial layers; FETs; Indium phosphide; Leakage current; Molecular beam epitaxial growth; Plasma chemistry; Plasma devices; Silicon; Substrates;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/EDL.1982.25480
Filename
1482585
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