• DocumentCode
    1082879
  • Title

    In0.53Ga0.47As FET´s with insulator-assisted Schottky gates

  • Author

    O´Connor, P. ; Pearsall, T.P. ; Cheng, K.Y. ; Cho, A.Y. ; Hwang, J.C.M. ; Alavi, K.

  • Author_Institution
    Bell Laboratories, Murray Hill, NJ
  • Volume
    3
  • Issue
    3
  • fYear
    1982
  • fDate
    3/1/1982 12:00:00 AM
  • Firstpage
    64
  • Lastpage
    66
  • Abstract
    Schottky-gate FET´s have been fabricated on n-type In0.53Ga0.47As using a thin interfacial silicon nitride layer between the metal and the epitaxial layer to reduce the gate leakage current. In0.53Ga0.47As was grown by molecular beam epitaxy on semi-insulating InP substrates and silicon nitride was grown by plasma-enhanced chemical vapor deposition. Devices with 1.2µm gate length and net donor doping in the mid 1016cm-3range show dc transconductance of up to 130mS/mm. Both depletion and enhancement mode operation were observed. The effective saturation velocity of electrons in the channel is deduced to be 2.0 ± 0.5 × 107cm/sec, a value 60 to 70% higher than that in GaAs MESFET´s. The insulator-assisted gate technology has many advantages in fabrication flexibility and control compared with other approaches to realizing high-speed microwave and logic in FET´s in In0.53Ga0.47As.
  • Keywords
    Chemical vapor deposition; Epitaxial layers; FETs; Indium phosphide; Leakage current; Molecular beam epitaxial growth; Plasma chemistry; Plasma devices; Silicon; Substrates;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/EDL.1982.25480
  • Filename
    1482585