• DocumentCode
    1083130
  • Title

    Laser activated flow of phosphosilicate glass in integrated circuit devices

  • Author

    Delfino, M. ; Reifsteck, T.A.

  • Author_Institution
    Fairchild Camera and Instrument Corporation, Palo Alto, CA
  • Volume
    3
  • Issue
    5
  • fYear
    1982
  • fDate
    5/1/1982 12:00:00 AM
  • Firstpage
    116
  • Lastpage
    118
  • Abstract
    The use of a cw CO2laser to flow phosphosilicate glass for the planarization of p+/n diode arrays is demonstrated. A power density flow threshold of 110 kW cm-2at a wavelength of 9.26 µm is estimated and found to be essentially invariant to the thickness of the glass (1.0 to 1.5 µm) and to the phosphorus concentration of the glass (3 to 9% wt). This laser activated process results in glass flow without impurity diffusion in the active device area and is therefore compatible with VLSI.
  • Keywords
    Absorption; Annealing; Boron; Chemical lasers; Diodes; Furnaces; Glass; Implants; Semiconductor laser arrays; Wet etching;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/EDL.1982.25504
  • Filename
    1482609