DocumentCode
108434
Title
Modeling of Vias Sharing the Same Antipad in Planar Waveguide With Boundary Integral Equation and Group T-Matrix Method
Author
Leung Tsang ; Xin Chang
Author_Institution
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
Volume
3
Issue
2
fYear
2013
fDate
Feb. 2013
Firstpage
315
Lastpage
327
Abstract
We consider multiple scattering among different groups of vias with each group of vias sharing one antipad in planar waveguide. A transformation is used that converts the 2-D discretization and 2-D surface integration of the product of Green´s functions and magnetic surface currents into 1-D discretization and 1-D integration of surface charges on the vias and on the ground plane. This is used to calculate the incident fields onto the vias. Based on the incident fields, the Foldy-Lax equations can be solved to calculate the circuit parameters for the problem. We show that the results are superior to the previously used finite difference method. In addition, the group T-matrix method is used to represent a group of vias to account for the scattering among different groups of vias. Results are illustrated for various cases of multiple vias up to 20 GHz. Results show the accuracy of the method even to very closely spaced vias when they are separated by merely 1 mil. Numerical results are in excellent agreement with ANSOFT HFSS.
Keywords
Green´s function methods; boundary integral equations; electromagnetic wave scattering; matrix algebra; planar waveguides; vias; 1D discretization; 1D surface charge integration; 2D discretization; 2D surface integration; ANSOFT HFSS; Foldy-Lax equations; Green functions; antipad; boundary integral equation; circuit parameter; finite difference method; ground plane; group T-matrix method; magnetic surface currents; planar waveguide; scattering; vias; Equations; Green´s function methods; Integral equations; Mathematical model; Scattering; Surface waves; Transmission line matrix methods; Foldy–Lax equations; T-matrix; multiple scattering; signal integrity; vias;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2012.2220771
Filename
6397593
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