DocumentCode
1085001
Title
Fundamental Building Blocks for Circuits on Textiles
Author
Locher, Ivo ; Tröster, Gerhard
Author_Institution
ETH Zurich, Zurich
Volume
30
Issue
3
fYear
2007
Firstpage
541
Lastpage
550
Abstract
This paper presents the necessary ingredients for a successful realization of electrical circuits on fabrics. We start with the specification of a hybrid fabric as substrate. The discussion of textile transmission lines as well as textile interconnects reveals a flat frequency response up to about 2 GHz and 600 MHz, respectively. The proposed transmission lines feature line impedances in the range of 250 Omega. A novel interposer concept is the key technology to our approach of implementing circuits on textiles. We introduce different variants of this interposer and give formulas to determine their fabric area consumption. The presented technologies allow realization and wiring of circuits on fabrics with signal frequencies up to several hundred megahertz.
Keywords
fabrics; intelligent materials; textile products; wearable computers; electrical circuits; fabric area consumption; hybrid fabric; interposer technology; line impedances; system-on-textile; textile interconnects; textile transmission lines; wearable computing; Clothing; Copper; Distributed parameter circuits; Fabrics; Integrated circuit interconnections; Textile technology; Transmission line measurements; Wearable computers; Wire; Yarn; Interposer technology; system-on-textile; textile interconnects; textile substrates; wearable computing;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2007.898636
Filename
4285941
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