Exact Analysis of the Wire-Bonded Multiconductor Transmission Line

Author

Page, Juan E. ; Márquez-Segura, Enrique ; Casares-Miranda, Francisco P. ; Esteban, Jaime ; Otero, Pablo ; Camacho-Penalosa, Carlos

Author_Institution

Univ. Polytech. de Madrid, Madrid

Volume

55

Issue

8

fYear

2007

Firstpage

1585

Lastpage

1592

Abstract

In this paper, the exact model of a multiconductor transmission line with bonding wires is presented. The model is based on the multiport admittance matrix, and is valid for any number of conductors in the structure. The model shows how to compute the two-port admittance matrix of the wire-bonded structure with direct application to the wire-bonded interdigital capacitor. The model has been validated by means of method-of-moments-based numerical simulation and by experimental work.

Keywords

capacitors; lead bonding; method of moments; microstrip components; multiconductor transmission lines; transmission line matrix methods; bonding wires; exact analysis; method-of-moments-based numerical simulation; multiport admittance matrix; two-port admittance matrix; wire-bonded interdigital capacitor; wire-bonded multiconductor transmission line; Admittance; Bonding; Capacitors; Conductors; Equations; Multiconductor transmission lines; Numerical simulation; Transmission line matrix methods; Voltage; Wires; Interdigital capacitor; microwave integrated circuits; microwave passive circuits; multiconductor transmission lines; wire bonding; wire-bonded interdigital capacitor;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.2007.902084

Filename

4287175