• DocumentCode
    1092288
  • Title

    Diagnosis of semiconductor manufacturing equipment and processes

  • Author

    Saxena, Sharad ; Unruh, Amy

  • Author_Institution
    Semicond. Process & Device Center, Texas Instrum. Inc., Dallas, TX, USA
  • Volume
    7
  • Issue
    2
  • fYear
    1994
  • fDate
    5/1/1994 12:00:00 AM
  • Firstpage
    220
  • Lastpage
    232
  • Abstract
    This paper describes part of the research performed during the Microelectronic Manufacturing Science and Technology (MMST) program on techniques for the diagnosis of equipment malfunctions and misprocessing during semiconductor manufacturing. The main motivation of this work was to investigate techniques for rapid diagnosis. Towards this goal, a number of equipment-level diagnosis techniques are described. These techniques use equipment models to diagnose equipment malfunctions at a given process step. The results obtained by applying these diagnosis approaches are very encouraging. The various approaches were able to diagnose a number of faults that were deliberately introduced to test the algorithms and the equipment faults that developed during the final demonstration of the MMST program. These techniques were applied to a TI-built Advanced Vacuum Processor (AVP) and an Applied Materials Precision reactor AMT 5000
  • Keywords
    fault location; integrated circuit manufacture; semiconductor device manufacture; semiconductor process modelling; Advanced Vacuum Processor; Applied Materials Precision reactor AMT 5000; MMST program; equipment malfunctions; equipment models; misprocessing; process models; rapid diagnosis; semiconductor manufacturing equipment diagnosis; semiconductor manufacturing processes diagnosis; Fault diagnosis; Manufacturing processes; Microelectronics; Predictive models; Pulp manufacturing; Redundancy; Response surface methodology; Semiconductor device manufacture; Semiconductor device modeling; Semiconductor process modeling;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.286857
  • Filename
    286857