Modeling the Broadband Inductive and Resistive Behavior of Composite Conductors

Accurately modeling interconnect structures is an important issue in high-frequency chip design. Conductors have a finite thickness and conductivity, and are often composed of different metals. It is shown that the Dirichlet-to-Neumann technique can be used to model the inductive and resistive behavior of such structures, up to high frequencies at which the skin effect is well-developed. Furthermore, the method can be used for the accurate and fast calculation of the longitudinal current distribution in the composite conductors.