• DocumentCode
    1097877
  • Title

    Polyhedral Superconducting Cavity for Particle Accelerators

  • Author

    McIntyre, Peter ; Pogue, Nathaniel ; Sattarov, Akhdiyor

  • Author_Institution
    Texas A&M Univ., College Station, TX, USA
  • Volume
    19
  • Issue
    3
  • fYear
    2009
  • fDate
    6/1/2009 12:00:00 AM
  • Firstpage
    1380
  • Lastpage
    1383
  • Abstract
    A polyhedral cavity design is being developed for particle accelerators, with particular potential application to future linac colliders. In essence it is a polyhedral analog of a multi-cell cavity, but the beam´s eye view of the boundaries is a polyhedron instead of a figure of revolution. A multi-cell cavity string is formed as a Roman arch assembly of polyhedral wedges; each wedge has its inner surface contoured to form the ellipsoidal shape desired for the accelerating mode. The polyhedral cavity design has been studied numerically and several significant results are reported. Its Q should be comparable to that of a TESLA cavity. The joints between wedge segments offer the possibility to internally suppress all dipole-type higher-order modes by intercepting and terminating azimuthal currents. The Nb surface is provided as a thin foil bonded to a solid copper wedge machined to the desired contour. The wedge provides stiff support so Lorentz detuning is largely eliminated, and the superfluid refrigeration could be integrated within the wedges so no pool cryostat is required.
  • Keywords
    accelerator cavities; linear accelerators; niobium; Lorentz detuning; Nb; Roman arch; TESLA cavity; accelerating mode; azimuthal currents; beam effect; cryostat; ellipsoidal shape; linac collider; multicell cavity string; numerical method; particle accelerator; polyhedral cavity design; polyhedral superconducting cavity; polyhedral wedge; solid copper wedge; superfluid refrigeration; Accelerator cavities; Nb; cavity structure;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2009.2018202
  • Filename
    5109573