• DocumentCode
    1098025
  • Title

    Modeling of Unsteady Laminar Flow Based on Steady Solution in Jetting Dispensing Process

  • Author

    Nguyen, Quoc Hung ; Choi, Seung-Bok

  • Author_Institution
    Inha Univ., Incheon
  • Volume
    31
  • Issue
    2
  • fYear
    2008
  • fDate
    4/1/2008 12:00:00 AM
  • Firstpage
    134
  • Lastpage
    142
  • Abstract
    This paper proposes a new approach to model unsteady laminar flows of dispenser systems in the semiconductor packaging industry. The approach is based on the exact steady solution. After an overview of dispensing technology and historical modeling of the unsteady flows, a new modeling approach of the unsteady laminar flow in a circular pipe and annular duct is developed. From the proposed model, the modeling results of unsteady flow in an arbitrary circular pipe and annular duct are obtained and compared with the spectral solution. In addition, a comparative work between the proposed analytical dynamic model and the finite-element model is undertaken in order to demonstrate the effectiveness of the proposed modeling methodology.
  • Keywords
    finite element analysis; flow instability; jets; laminar flow; pipe flow; semiconductor device manufacture; analytical dynamic model; annular duct; circular pipe; dispensing technology; finite-element model; historical modeling; jetting dispensing process; semiconductor packaging industry; unsteady laminar flow; Dispensing technology; power-law fluid; steady solution; unsteady flow;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2008.919348
  • Filename
    4470119