DocumentCode
1098025
Title
Modeling of Unsteady Laminar Flow Based on Steady Solution in Jetting Dispensing Process
Author
Nguyen, Quoc Hung ; Choi, Seung-Bok
Author_Institution
Inha Univ., Incheon
Volume
31
Issue
2
fYear
2008
fDate
4/1/2008 12:00:00 AM
Firstpage
134
Lastpage
142
Abstract
This paper proposes a new approach to model unsteady laminar flows of dispenser systems in the semiconductor packaging industry. The approach is based on the exact steady solution. After an overview of dispensing technology and historical modeling of the unsteady flows, a new modeling approach of the unsteady laminar flow in a circular pipe and annular duct is developed. From the proposed model, the modeling results of unsteady flow in an arbitrary circular pipe and annular duct are obtained and compared with the spectral solution. In addition, a comparative work between the proposed analytical dynamic model and the finite-element model is undertaken in order to demonstrate the effectiveness of the proposed modeling methodology.
Keywords
finite element analysis; flow instability; jets; laminar flow; pipe flow; semiconductor device manufacture; analytical dynamic model; annular duct; circular pipe; dispensing technology; finite-element model; historical modeling; jetting dispensing process; semiconductor packaging industry; unsteady laminar flow; Dispensing technology; power-law fluid; steady solution; unsteady flow;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2008.919348
Filename
4470119
Link To Document