• DocumentCode
    1098621
  • Title

    Effects of Backfilling on Cable Ampacity Analyzed With the Finite Element Method

  • Author

    De León, Francisco ; Anders, George J.

  • Author_Institution
    Polytech. Univ., Brooklyn
  • Volume
    23
  • Issue
    2
  • fYear
    2008
  • fDate
    4/1/2008 12:00:00 AM
  • Firstpage
    537
  • Lastpage
    543
  • Abstract
    Expressions for computing the external thermal resistance (T4) of buried cables, in both the IEEE and the IEC standards, are applicable to a limited number of installation geometries. In this paper, a method for the computation of T4 using the finite element approach is presented. With this method, a parametric study on how cable ampacity is affected by different configurations of the backfills is performed. The obtained results are compared with those of the IEC and IEEE standards (Neher-McGrath) and published extensions by El-Kady and Horrocks. Important differences can be observed for nonstandardized situations.
  • Keywords
    IEC standards; IEEE standards; finite element analysis; power cables; thermal resistance; underground cables; IEC standards; IEEE standards; backfilling effect; buried cables; cable ampacity; external thermal resistance; finite element method; Ampacity; Neher–McGrath; backfill; cable thermal rating; external thermal resistance; finite element method; underground cables;
  • fLanguage
    English
  • Journal_Title
    Power Delivery, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-8977
  • Type

    jour

  • DOI
    10.1109/TPWRD.2008.917648
  • Filename
    4470560
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1098621