• DocumentCode
    1099077
  • Title

    A wafer-scale digital integrator using restructurable VSLI

  • Author

    Raffel, J.I. ; Anderson, A.H. ; Chapman, G.H. ; Konkle, K.H. ; Mathur, B. ; Soares, A.M. ; Wyatt, P.W.

  • Author_Institution
    Massachusetts Institute of Technology, Lincoln Laboratory, Lexington, MA
  • Volume
    32
  • Issue
    2
  • fYear
    1985
  • fDate
    2/1/1985 12:00:00 AM
  • Firstpage
    479
  • Lastpage
    486
  • Abstract
    Wafer-scale integration has been demonstrated by fabricating a digital integrator on a monolithic 20-cm2silicon chip, the first laser-restructured digital logic system. Large-area integration is accomplished by laser programming of metal interconnect for defect avoidance. This paper describes the technology for laser welding and cutting, the design methodology and CAD tools developed for wafer-scale integration, and the integrator itself.
  • Keywords
    Design automation; Design methodology; Dielectrics; Integrated circuit interconnections; Laser beam cutting; Logic circuits; Optical design; Optical device fabrication; Silicon; Welding;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1985.21966
  • Filename
    1484713
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1099077