DocumentCode
109942
Title
Shock Reliability of Vacuum-Packaged Piezoelectric Vibration Harvester for Automotive Application
Author
Ziyang Wang ; Elfrink, R. ; Rovers, Madelon ; Matova, S. ; van Schaijk, R. ; Renaud, Martin
Author_Institution
Holst Centre, Stichting imec Nederland, Eindhoven, Netherlands
Volume
23
Issue
3
fYear
2014
fDate
Jun-14
Firstpage
539
Lastpage
548
Abstract
This paper reports for the first time the shock reliability of vacuum-packaged piezoelectric vibration harvesters for automotive application. Experimental study on >80 devices shows that the failure is induced by the impact between seismic mass and glass package. The statistical results obtained for various types of harvesters have shown a trend of higher shock reliability for a higher resonance frequency. The influence of beam thickness on the shock reliability is then discussed. The trade-off between the power output and shock reliability is elaborated. To further improve the reliability to the level of automotive application, the idea of stepped cavity is discussed and implemented. The experimental results confirmed a significantly enhanced reliability increased by ~50%, up to maximum 2000 g, for the same type of device under shock excitations.
Keywords
automotive engineering; energy harvesting; piezoelectric transducers; reliability; vibrations; automotive application; beam thickness; glass package; resonance frequency; seismic mass; shock reliability; stepped cavity; vacuum-packaged piezoelectric vibration harvester; Electric shock; Glass; Reliability; Silicon; Stress; Structural beams; Vibrations; Energy harvester; piezoelectric; shock reliability; shock reliability.;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2013.2291010
Filename
6674988
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