• DocumentCode
    109942
  • Title

    Shock Reliability of Vacuum-Packaged Piezoelectric Vibration Harvester for Automotive Application

  • Author

    Ziyang Wang ; Elfrink, R. ; Rovers, Madelon ; Matova, S. ; van Schaijk, R. ; Renaud, Martin

  • Author_Institution
    Holst Centre, Stichting imec Nederland, Eindhoven, Netherlands
  • Volume
    23
  • Issue
    3
  • fYear
    2014
  • fDate
    Jun-14
  • Firstpage
    539
  • Lastpage
    548
  • Abstract
    This paper reports for the first time the shock reliability of vacuum-packaged piezoelectric vibration harvesters for automotive application. Experimental study on >80 devices shows that the failure is induced by the impact between seismic mass and glass package. The statistical results obtained for various types of harvesters have shown a trend of higher shock reliability for a higher resonance frequency. The influence of beam thickness on the shock reliability is then discussed. The trade-off between the power output and shock reliability is elaborated. To further improve the reliability to the level of automotive application, the idea of stepped cavity is discussed and implemented. The experimental results confirmed a significantly enhanced reliability increased by ~50%, up to maximum 2000 g, for the same type of device under shock excitations.
  • Keywords
    automotive engineering; energy harvesting; piezoelectric transducers; reliability; vibrations; automotive application; beam thickness; glass package; resonance frequency; seismic mass; shock reliability; stepped cavity; vacuum-packaged piezoelectric vibration harvester; Electric shock; Glass; Reliability; Silicon; Stress; Structural beams; Vibrations; Energy harvester; piezoelectric; shock reliability; shock reliability.;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2013.2291010
  • Filename
    6674988