Cost saving opportunities with multichip modules

Author

Mavroides, Joanne

Author_Institution

Digital Equipment Corp., Maynard, MA, USA

Volume

15

Issue

3

fYear

1992

fDate

6/1/1992 12:00:00 AM

Firstpage

295

Lastpage

298

Abstract

Multichip modules (MCMs) have been utilized in the electronics industry, predominantly for physical size and performance driven applications. An MCM application that was driven by cost is described. The study of MCM technologies focused on the MCM assembly and interconnect to the motherboard. Models were developed to calculate the assembly and test costs for MCMs using wirebond and TAB technologies. Another model was used to evaluate interconnect options, both separable and nonseparable (e.g. soldered). A cost analysis verified that a significant cost savings was achieved by using MCM technology and, along with a technical evaluation of the alternatives, led to an MCM physical design for this application

Keywords

hybrid integrated circuits; packaging; MCM; MCM assembly; TAB technologies; cost analysis; cost reduction; cost savings; electronics industry; multichip modules; performance driven applications; size reduction; technical evaluation; test costs; wirebond; Assembly; Costs; Electronics packaging; Integrated circuit packaging; Integrated circuit technology; Manufacturing; Materials testing; Multichip modules; Polyimides; Raw materials;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.148493

Filename

148493