• DocumentCode
    1108249
  • Title

    Evaluation of solders for superconducting magnetic shield

  • Author

    Seo, K. ; Nishijima, S. ; Katagir, K. ; Okada, T.

  • Author_Institution
    ISIR, Osaka Univ., Japan
  • Volume
    27
  • Issue
    2
  • fYear
    1991
  • fDate
    3/1/1991 12:00:00 AM
  • Firstpage
    1877
  • Lastpage
    1880
  • Abstract
    A magnetic shield with a superconducting winding has been studied aiming at the practical application of the shield in a magnetic field of higher than 3 T. Tubular magnetic shields have been fabricated with superconducting windings using NbTi multifilamentary composite wires. The shields were impregnated with two kinds of solders (Wood´s metal and indium) to make the electric joint between the wires. In spite of the fact that the superconducting wire provides enough performance to shield the external field of 4 T (Ic=225 A at 4 T), the maximum shielded field of the actual shield was 3.42 T. The superconducting magnetic shield inevitably induces a high-field region near the surface of the shield, and hence the performance of the solder under high field determines the shielding ability. After testing several alloy mixtures to see which provides improved joint properties (joint resistance and therefore Ic), a high-performance shield was fabricated
  • Keywords
    composite superconductors; magnetic shielding; soldering; superconducting devices; 3.42 T; 4 T; In solder; NbTi multifilamentary composite wires; NbTi-In; NbTi-PbSn; PbSn solders; Wood´s metal; critical currents; high-field region; high-performance shield; joint resistance; solders; superconducting magnetic shield; Copper; Indium; Magnetic shielding; Multifilamentary superconductors; Niobium compounds; Superconducting filaments and wires; Superconducting integrated circuits; Superconducting magnets; Superconducting materials; Titanium compounds;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.133563
  • Filename
    133563