C-SAM sounds the warning for IC packaging defects

Author

Yalamanchili, Prasad ; Christou, Aris ; Martell, Steve ; Rust, Carl

Author_Institution

CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA

Volume

10

Issue

4

fYear

1994

fDate

7/1/1994 12:00:00 AM

Firstpage

36

Lastpage

41

Abstract

C-mode acoustic microscopy provides unique advantages over SLAM techniques in detecting microcracks, voids, and delaminations. The reliability of integrated circuit (IC) packages depends in many respects on their mechanical integrity. The effect of structural weaknesses caused by poor bonding, voids, microcracks or delaminations may not be evident in the electrical performance characteristics, but may cause premature failure. C-mode scanning acoustic microscopy (C SAM) is an excellent tool for non-destructive failure analysis of IC packages. It provides a rapid and comprehensive imaging of critical package defects and the location of these defects in three dimensions within the package.<>

Keywords

acoustic microscopy; circuit reliability; crack detection; delamination; failure analysis; integrated circuit testing; packaging; voids (solid); C-SAM; C-mode acoustic microscopy; C-mode scanning acoustic microscopy; IC package reliability; IC packaging defects; critical package defects; delaminations; electrical performance characteristics; mechanical integrity; microcracks; nondestructive failure analysis; poor bonding; premature failure; reliability; structural weaknesses; three dimensions; voids; Acoustic imaging; Acoustic signal detection; Bonding; Delamination; Electronics packaging; Failure analysis; Integrated circuit packaging; Laser modes; Microscopy; Simultaneous localization and mapping;

fLanguage

English

Journal_Title

Circuits and Devices Magazine, IEEE

Publisher

ieee

ISSN

8755-3996

Type

jour

DOI

10.1109/101.294744

Filename

294744