DocumentCode
1114440
Title
Thermal Aging Reliability of Package-Level Polymer Optical Waveguides
Author
Hegde, Shashikant G. ; Sitaraman, Suresh K.
Author_Institution
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA
Volume
31
Issue
2
fYear
2008
fDate
5/1/2008 12:00:00 AM
Firstpage
410
Lastpage
416
Abstract
Polymer optical waveguides are viewed as a potential interconnect solution in board-level optoelectronic systems. In this paper, the optical loss changes in siloxane polymer waveguides during thermal aging conditions are studied for the wavelengths of 850 and 1310 nm. The optical loss in waveguides during intended operation and temperature exposure can increase due to factors such as oxidation of waveguides, increased absorption, and scattering. In addition to these inherent changes in the optical properties of the waveguides, physical failures such as delamination and cracking of waveguides will also increase the optical loss. This paper focuses on the first set of parameters that affects the optical loss and as a first step; the optical absorption of the polymer material is characterized through spectroscopy experiments. The thermal-aging dependent optical loss is determined for waveguide samples at several different accelerated temperature conditions. The temperature contours in a polymer waveguide with an embedded laser are determined from experiments as well as finite-element modeling. Using experimental data, analytical models have been developed that relate the optical loss with temperature and time, and provide a practical way of determining the reliability of the optical waveguides during field-use conditions.
Keywords
absorption; finite element analysis; optical waveguides; oxidation; polymers; reliability; board-level optoelectronic systems; finite-element modeling; optical absorption; optical loss; oxidation; package-level polymer optical waveguides; polymer material; thermal aging reliability; wavelength 1310 nm; wavelength 850 nm; Acceleration factor; Arrhenius equation; finite-element modeling; optical loss; polymer waveguides; reliability; spectroscopy; thermal aging;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2008.920653
Filename
4476765
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