DocumentCode
1117773
Title
Statistical design techniques for high-speed circuit boards with correlated structure distributions
Author
Mikazuki, Tetsuo ; Matsui, Norio
Author_Institution
Phys. Design Res. Group, NTT Commun. Switching Labs., Musashino, Japan
Volume
17
Issue
1
fYear
1994
fDate
3/1/1994 12:00:00 AM
Firstpage
159
Lastpage
165
Abstract
New statistical techniques have been developed for designing the line structures of high-speed circuit boards. These techniques take into account the correlations between dimensional deviations caused by the fabrication process. Monte Carlo simulation is introduced into the finite-element method in order to calculate distributions of line parameters, and distributed circuit models are used to calculate the corresponding eye-patterns at the receiving end of transmission lines with parallel and stub parts. The simulator has an algorithm to save computer time. This paper compares the calculated and experimental results and discusses the accuracy of the simulation. Calculation results imply that the evaluation of the dimensional distributions due to fabrication processes is very important. The timing and amplitude margins, for example, were found to strongly depend on fabrication deviations. These techniques may be easily applied to the control of fabrication deviations to ensure that high-speed circuit boards meet electrical requirements
Keywords
Monte Carlo methods; circuit CAD; circuit analysis computing; finite element analysis; printed circuit design; statistical analysis; Monte Carlo simulation; PCB design; correlated structure distributions; distributed circuit models; fabrication deviations; finite-element method; high-speed circuit boards; line structures; statistical design techniques; Acoustic reflection; Circuit noise; Circuit simulation; Communication switching; Computational modeling; Crosstalk; Distributed parameter circuits; Fabrication; Finite element methods; Printed circuits;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.296384
Filename
296384
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