Delay and reflection noise macromodeling for signal integrity management of PCBs and MCMs

Author

Simovich, Slobodan ; Mehrotra, Sharad ; Franzon, Paul ; Steer, Michael

Author_Institution

Dept. of Electr. & Comput. Eng., North Carolina State Univ., CA, USA

Volume

17

Issue

1

fYear

1994

fDate

2/1/1994 12:00:00 AM

Firstpage

15

Lastpage

21

Abstract

The current approaches to generating wiring rules for high speed PCBs and MCMs are unsatisfactory because they require intensive manual efforts or use over-simplifications In this paper, an automated approach based on a-priori simulation-based characterization of the interconnect circuit configurations is presented. The improved flexibility and accuracy provided by this approach, when compared with traditional approaches, are demonstrated via an MCM interconnect example

Keywords

circuit analysis computing; circuit layout CAD; delays; multichip modules; noise; printed circuit design; MCMs; PCBs; automated approach; delay modelling; interconnect circuit configurations; packaging; reflection noise macromodeling; signal integrity management; simulation-based characterization; wiring rules; Acoustic reflection; Circuit simulation; Delay; Equations; Expert systems; Integrated circuit interconnections; Signal design; Thumb; Timing; Wiring;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.296426

Filename

296426