• DocumentCode
    1120950
  • Title

    Modelling and analysis of ground bounce due to internal gate switching

  • Author

    Yang, L. ; Yuan, J.S.

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Univ. of Central Florida, Orlando, FL, USA
  • Volume
    151
  • Issue
    4
  • fYear
    2004
  • Firstpage
    300
  • Lastpage
    306
  • Abstract
    Ground bounce noise due to internal gate switching is studied. Unlike the ground bounce caused by switching of the output buffer, both power-rail and ground-rail impedances are important, and a double negative feedback mechanism must be considered. Based on the lumped-model analysis and taking into account the parasitic and velocity-saturation effects of MOS transistors, an analytical model is developed including both switching and non-switching gates. The proposed model is employed to analyse the on-chip decoupling capacitance, resonant frequency, wire/pin inductance and loading effect. Good agreement between the model predictions and SPICE simulation results is obtained.
  • Keywords
    MOS logic circuits; SPICE; logic gates; semiconductor device models; semiconductor device noise; MOS transistors; SPICE simulation; ground bounce noise; ground-rail impedances; internal gate switching; loading effect; lumped-model analysis; model predictions; negative feedback mechanism; nonswitching gates; on-chip decoupling capacitance; output buffer; parasitic effects; pin inductance; power-rail impedance; resonant frequency; switching gates; velocity-saturation effects; wire inductance;
  • fLanguage
    English
  • Journal_Title
    Circuits, Devices and Systems, IEE Proceedings
  • Publisher
    iet
  • ISSN
    1350-2409
  • Type

    jour

  • DOI
    10.1049/ip-cds:20040190
  • Filename
    1338141