• DocumentCode
    1124416
  • Title

    Electromechanical and Thermal Characterization of Stacked Bi-2223 Tapes at Cryogenic Temperature

  • Author

    Keller, Philipp ; Schwarz, Michael ; Weiss, Klaus-Peter ; Heller, Reinhard ; Jung, Alexandra ; Aubele, Andre

  • Author_Institution
    Inst. for Tech. Phys., Forschungszentrum Karlsruhe GmbH, Eggenstein-Leopoldshafen, Germany
  • Volume
    19
  • Issue
    3
  • fYear
    2009
  • fDate
    6/1/2009 12:00:00 AM
  • Firstpage
    2893
  • Lastpage
    2896
  • Abstract
    Within cryogenic applications and the use of superconductors, efficient current leads are needed. Especially the circumstance to feed electrical current from a source at room temperature into the cryogenic system, while minimizing the heat load, is problematic. These special conductors have to be tailored in electrical and thermal properties by their material composition. In this work properties of stacked Bi-2223 superconducting tapes for current lead application are characterized, like critical current under applied tensile load, thermal properties as thermal conductivity and thermal expansion. The results are used to investigate the influence of the different material components on the performance of the conductor.
  • Keywords
    bismuth compounds; calcium compounds; critical currents; cryogenics; electromechanical effects; high-temperature superconductors; lead compounds; strontium compounds; superconducting tapes; tensile strength; thermal conductivity; thermal expansion; Bi2-xPbxSr2Ca2Cu3O10; critical current; cryogenic temperature; current lead application; electrical current; electromechanical characterization; stacked Bi-2223 superconducting tapes; tensile load; thermal characterization; thermal conductivity; thermal expansion; Electromechanical effects; high-temperature superconductors; materials testing; thermal factors;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2009.2018503
  • Filename
    5153255