• DocumentCode
    1140351
  • Title

    High transmission gain integrated antenna on extremely high resistivity Si for ULSI wireless interconnect

  • Author

    Rashid, A.B.M.H. ; Watanabe, S. ; Kikkawa, T.

  • Author_Institution
    Res. Center for Nanodevices & Syst., Hiroshima Univ., Japan
  • Volume
    23
  • Issue
    12
  • fYear
    2002
  • Firstpage
    731
  • Lastpage
    733
  • Abstract
    We have demonstrated the highest transmission gain integrated dipole antenna on Si reported so far, to use as an integrated antenna for the purpose of ULSI on-chip wireless interconnection. A 2-mm long and 10-μm wide dipole antenna pair at a distance of 1 cm shows a transmission gain of -36.5 dB at 18 GHz, which is 20 dB higher than the previously reported gain. This large increase in gain is achieved by proton implantation on the Si substrate, which increased the resistivity from 10 /spl Omega/-cm to 0.1 M/spl Omega/-cm. It is also found that transmission gain can be maximized for a given resistivity by optimizing the Si substrate thickness or by inserting a low-k dielectric layer below the substrate.
  • Keywords
    ULSI; dipole antennas; electrical resistivity; integrated circuit interconnections; ion implantation; -36.5 dB; 10 micron; 10 ohmcm to 0.1 Mohmcm; 18 GHz; 2 mm; Si; Si substrate; Si substrate thickness optimization; ULSI on-chip wireless interconnection; ULSI wireless interconnect; dipole antenna pair; extremely high resistivity Si; high transmission gain integrated dipole antenna; low-k dielectric layer; proton implantation; transmission gain; Aluminum; Clocks; Conducting materials; Conductivity; Dielectric substrates; Dipole antennas; Integrated circuit interconnections; Protons; Transmitting antennas; Ultra large scale integration;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2002.805754
  • Filename
    1177968