DocumentCode
1140351
Title
High transmission gain integrated antenna on extremely high resistivity Si for ULSI wireless interconnect
Author
Rashid, A.B.M.H. ; Watanabe, S. ; Kikkawa, T.
Author_Institution
Res. Center for Nanodevices & Syst., Hiroshima Univ., Japan
Volume
23
Issue
12
fYear
2002
Firstpage
731
Lastpage
733
Abstract
We have demonstrated the highest transmission gain integrated dipole antenna on Si reported so far, to use as an integrated antenna for the purpose of ULSI on-chip wireless interconnection. A 2-mm long and 10-μm wide dipole antenna pair at a distance of 1 cm shows a transmission gain of -36.5 dB at 18 GHz, which is 20 dB higher than the previously reported gain. This large increase in gain is achieved by proton implantation on the Si substrate, which increased the resistivity from 10 /spl Omega/-cm to 0.1 M/spl Omega/-cm. It is also found that transmission gain can be maximized for a given resistivity by optimizing the Si substrate thickness or by inserting a low-k dielectric layer below the substrate.
Keywords
ULSI; dipole antennas; electrical resistivity; integrated circuit interconnections; ion implantation; -36.5 dB; 10 micron; 10 ohmcm to 0.1 Mohmcm; 18 GHz; 2 mm; Si; Si substrate; Si substrate thickness optimization; ULSI on-chip wireless interconnection; ULSI wireless interconnect; dipole antenna pair; extremely high resistivity Si; high transmission gain integrated dipole antenna; low-k dielectric layer; proton implantation; transmission gain; Aluminum; Clocks; Conducting materials; Conductivity; Dielectric substrates; Dipole antennas; Integrated circuit interconnections; Protons; Transmitting antennas; Ultra large scale integration;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2002.805754
Filename
1177968
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