• DocumentCode
    1143933
  • Title

    Efficiency of SOI-like structures for reducing the thermal resistance in thin-film SOI power LDMOSFETs

  • Author

    Roig, J. ; Urresti, J. ; Cortés, I. ; Flores, D. ; Hidalgo, S. ; Millán, J.

  • Author_Institution
    Centre Nacional de Microelectron., Barcelona, Spain
  • Volume
    25
  • Issue
    11
  • fYear
    2004
  • Firstpage
    743
  • Lastpage
    745
  • Abstract
    Silicon-on-insulator (SOI)-like structures to remove the heat from the active silicon layer in thin-film SOI power lateral double diffused MOS field-effect transistors have been recently reported. This paper provides an experimental demonstration of their efficiency. For this purpose, a heater-sensor system based on poly-Si and platinum resistor stripes, respectively, has been integrated in thermal contact with the active silicon layer under study. The thermal resistance reduction due to the contact-through-buried-oxide technique and the SOI-multilayer substrates have been analyzed at steady state using different SOI layer thicknesses and heat source lengths, in accordance with the state-of-the-art. In addition, experimental results are supported by those extracted from numerical simulation of the heater-sensor system.
  • Keywords
    power MOSFET; silicon-on-insulator; thermal resistance; thin film transistors; SOI-like structures; SOI-multilayer substrates; active silicon layer; contact-through-buried-oxide technique; heater-sensor system; platinum resistor stripes; poly-Si; power lateral double diffused MOSFET; self-heating effect; silicon-on-insulator; thermal contact; thermal resistance reduction; thin-film SOI power LDMOSFET; Contact resistance; FETs; Platinum; Resistors; Semiconductor thin films; Silicon on insulator technology; Steady-state; Substrates; Thermal resistance; Thin film transistors; LDMOS; Lateral double diffused MOS; SHE; self-heating effect; thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2004.837580
  • Filename
    1347214