• DocumentCode
    1144641
  • Title

    Thermal analysis of laser drilling processes

  • Author

    Paek, Un-Chul ; Gagliano, Frakcis P.

  • Author_Institution
    Engrg. Research Center, Western Electric Company, Inc., Princton, NJ, USA
  • Volume
    8
  • Issue
    2
  • fYear
    1972
  • fDate
    2/1/1972 12:00:00 AM
  • Firstpage
    112
  • Lastpage
    119
  • Abstract
    A model has been developed that uses a continuous, distributed, and moving heat source to describe the temperature profile and thermal stress propagation for laser drilled holes in high-purity fired-alumina ceramic substrate material. The temperature profile and the tangential stress distribution of the laser-formed hole are calculated to indicate the magnitude of those factors that can influence the potential fracture of the alumina material. These factors are of interest in order to help establish optimum laser-drilling parameters. Experimental data are obtained from the ruby and CO2lasers operated in the pulsed mode. The experimental results are found to be in excellent agreement with the theoretical analysis.
  • Keywords
    Ceramics; Drilling; Laser beams; Laser modes; Laser theory; Optical materials; Ring lasers; Temperature; Thermal conductivity; Thermal stresses;
  • fLanguage
    English
  • Journal_Title
    Quantum Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9197
  • Type

    jour

  • DOI
    10.1109/JQE.1972.1076946
  • Filename
    1076946