DocumentCode
1144641
Title
Thermal analysis of laser drilling processes
Author
Paek, Un-Chul ; Gagliano, Frakcis P.
Author_Institution
Engrg. Research Center, Western Electric Company, Inc., Princton, NJ, USA
Volume
8
Issue
2
fYear
1972
fDate
2/1/1972 12:00:00 AM
Firstpage
112
Lastpage
119
Abstract
A model has been developed that uses a continuous, distributed, and moving heat source to describe the temperature profile and thermal stress propagation for laser drilled holes in high-purity fired-alumina ceramic substrate material. The temperature profile and the tangential stress distribution of the laser-formed hole are calculated to indicate the magnitude of those factors that can influence the potential fracture of the alumina material. These factors are of interest in order to help establish optimum laser-drilling parameters. Experimental data are obtained from the ruby and CO2 lasers operated in the pulsed mode. The experimental results are found to be in excellent agreement with the theoretical analysis.
Keywords
Ceramics; Drilling; Laser beams; Laser modes; Laser theory; Optical materials; Ring lasers; Temperature; Thermal conductivity; Thermal stresses;
fLanguage
English
Journal_Title
Quantum Electronics, IEEE Journal of
Publisher
ieee
ISSN
0018-9197
Type
jour
DOI
10.1109/JQE.1972.1076946
Filename
1076946
Link To Document