DocumentCode
1145091
Title
Component-placement optimization for convectively cooled electronics
Author
Dancer, David ; Pecht, Michael
Author_Institution
Maryland Univ., College Park, MD, USA
Volume
38
Issue
2
fYear
1989
fDate
6/1/1989 12:00:00 AM
Firstpage
199
Lastpage
205
Abstract
A discussion is presented of the optimum positioning of a sequence of convectively cooled electronic devices in order to reduce failures due to thermal factors. A set of equations is developed for optimizing the positioning of the devices. This problem is analogous to the classical operations research problem of the optimum time scheduling of several jobs on a single machine, where for each job there is a time-dependent completion penalty. Several solution techniques for solving the simplified problem are formulated and compared with respect to their accuracy and computational speed
Keywords
failure analysis; optimisation; reliability theory; component placement optimisation; convectively cooled electronics; dynamic programming; failure rate; optimum positioning; reliability; thermal factors; Coolants; Design optimization; Dynamic programming; Educational institutions; Equations; Indexing; Temperature sensors; Thermal engineering; Thermal factors; Wiring;
fLanguage
English
Journal_Title
Reliability, IEEE Transactions on
Publisher
ieee
ISSN
0018-9529
Type
jour
DOI
10.1109/24.31105
Filename
31105
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