Wide-band finite ground coplanar (FGC) interconnects for on-chip packaging of RF MEMS switches used in smart antennas and phased arrays

Author

Morton, Matthew A. ; Papapolymerou, John

Author_Institution

Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

3

Issue

1

fYear

2004

Firstpage

239

Lastpage

242

Abstract

A wide-band finite ground coplanar (FGC) interconnect is presented for use in thermal compression bonded packages for RF MEMS devices that are used for the development of smart antennas and electronically steered phased arrays at up to 50 GHz. The fabrication process is compatible with standard IC fabrication techniques, and allows for simple, high-performance, and cost-effective on-chip packaging of such devices on the same substrate as the antenna elements. The measured attenuation is approximately 0.25 dB per interconnect, and is relatively constant from 2 to 50 GHz.

Keywords

UHF integrated circuits; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; micromechanical devices; microswitches; microwave integrated circuits; millimetre wave integrated circuits; 2 to 50 GHz; RF MEMS devices; RF MEMS switches; electronically steered phased arrays; finite ground coplanar interconnect; on-chip packaging; smart antennas; standard IC fabrication techniques; thermal compression bonded packages; wideband interconnect;

fLanguage

English

Journal_Title

Antennas and Wireless Propagation Letters, IEEE

Publisher

ieee

ISSN

1536-1225

Type

jour

DOI

10.1109/LAWP.2004.836573

Filename

1349294