• DocumentCode
    1147450
  • Title

    A Novel Time-Domain Approach for Extracting Broadband Models of Power Delivery NetworksWith Resonance Effect

  • Author

    Wang, Chen-Chao ; Kuo, Chih-Wen ; Wu, Sung-Mao ; Cheng, Hung-Hsiang ; Chiu, Chi-Tsung ; Hung, Chih-Pin

  • Author_Institution
    Electr. Lab., Adv. Semicond. Eng. (ASE), Inc., Kaohsiung, Taiwan
  • Volume
    32
  • Issue
    3
  • fYear
    2009
  • Firstpage
    636
  • Lastpage
    643
  • Abstract
    Resonance noise, or power/ground bounce noise, on the power and ground planes of high-speed circuit packages is one of the main concerns of signal integrity or power integrity issues. A novel time-domain approach is proposed to synthesize the broadband models of the power/ground planes with resonance effect. Using waveforms either from measurements by time-domain reflectrometry or simulations by the finite-difference time-domain method, the time-domain step response of the planes is characterized with a pole-residue representation obtained through the matrix pencil method. Lumped circuit equivalent circuit models are then synthesized through the pole-residue representations. The synthesized model can accurately predict the resonance behavior of power/ground planes over a wide frequency range. These models can be efficiently incorporated into the currently available circuit simulator such as HSPICE for the consideration of power/ground bouncing noise in high-speed circuits. Three cases are tested to demonstrate the validity and broadband accuracy of the proposed approach.
  • Keywords
    equivalent circuits; finite difference time-domain analysis; high-speed techniques; lumped parameter networks; network synthesis; broadband model; circuit simulator; finite-difference time-domain method; high-speed circuit package; lumped circuit equivalent circuit model; matrix pencil method; pole-residue representation; power delivery network; power integrity; resonance effect; signal integrity; time-domain approach; Finite-difference time-domain (FDTD); matrix pencil (MP); power integrity; time-domain reflectometry (TDR);
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2009.2023510
  • Filename
    5173509