DocumentCode
114756
Title
Bonding stress analysis on Palladium bond pad between Cu and Au FAB
Author
Sauli, Zaliman ; Retnasamy, Vithyacharan ; Mamat, H.
Author_Institution
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Arau, Malaysia
fYear
2014
fDate
27-29 Aug. 2014
Firstpage
123
Lastpage
125
Abstract
This papers presents the simulation investigation of bond pad stress analysis during wire bonding contact stage. The contact of gold free air ball (FAB) and copper (FAB) on Palladium (Pd) bond pad were evaluated through simulation. The stress of wire FAB, Pd bond pad and copper lead frame during FAB contact were compared for both wire materials. Ansys 11 was used for the analysis. Outcome of the analysis exhibited that the contact force significantly influences the stress on the FAB, bond pad and lead frame. FAB wire material comparison showed that the stress of Cu wire FAB was larger compared to the Gold FAB.
Keywords
copper; gold; lead bonding; palladium; semiconductor process modelling; stress analysis; Ansys 11; Au; Cu; FAB; Pd; bonding stress analysis; contact force; copper FAB; gold free air ball; lead frame; palladium bond pad; wire bonding contact stage; wire material; Bonding; Copper; Gold; Materials; Stress; Wires; Ansys; Copper FAB; Gold FAB; Pd bond pad; contact stage;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
Conference_Location
Kuala Lumpur
Type
conf
DOI
10.1109/SMELEC.2014.6920811
Filename
6920811
Link To Document