• DocumentCode
    1147563
  • Title

    Numerical Computation of AC Losses and Flux Profiles in High-Aspect-Ratio Superconducting Strips in Perpendicular AC Magnetic Field

  • Author

    Thakur, Kailash Prasad ; Staines, Michael Philip ; Lakshmi, L. Seetha ; Long, Nicholas J.

  • Author_Institution
    Ind. Res. Ltd., Lower Hutt, New Zealand
  • Volume
    19
  • Issue
    6
  • fYear
    2009
  • Firstpage
    3770
  • Lastpage
    3778
  • Abstract
    We present the results of finite-element modeling of a YBCO thin-film superconductor deposited on a nonmagnetic substrate and on a weakly ferromagnetic substrate. The model was implemented using commercial software to calculate the ac loss in the presence of a sinusoidal external magnetic field applied perpendicular to the surface of the superconducting tape. A strategy is demonstrated to overcome the difficulties in the finite-element method due to the high aspect ratio of the YBCO film by using the computed values of ac loss for thicker samples to extrapolate the results to the actual physical thickness of the superconductor ( ~ 1 mum). The effect of the width of the weekly ferromagnetic substrate upon the ac loss of the superconductor film has also been studied.
  • Keywords
    barium compounds; ferromagnetic materials; finite element analysis; high-temperature superconductors; nickel alloys; superconducting tapes; superconducting thin films; tungsten alloys; yttrium compounds; AC losses; NiW; YBa2Cu3O7-delta; finite-element modeling; flux profiles; high-aspect-ratio superconducting strips; nonmagnetic substrate; numerical computation; perpendicular AC magnetic field; sinusoidal external magnetic field; superconducting tape; thin-film superconductor deposition; weakly ferromagnetic substrate; Ferromagnetic substrate; finite-element methods (FEMs); magnetization loss; modeling; superconducting tape;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2009.2025887
  • Filename
    5173519