• DocumentCode
    114944
  • Title

    Modeling and FEM simulation using fluid-structures interaction of flexible micro-bridge bending within PDMS micro-channel

  • Author

    Belgroune, Nadir ; Hassein-Bey, Abdelkader ; Majlis, Burhanuddin Yeop ; Benamar, Mohamed El-Amine

  • Author_Institution
    Fac. of Sci., FUNDAPL, MEMS & NEMS Phys. Group, Univ. Saad Dahlab Blida 1, Blida, Algeria
  • fYear
    2014
  • fDate
    27-29 Aug. 2014
  • Firstpage
    495
  • Lastpage
    498
  • Abstract
    The manipulation of fluid flow in micro-channel with dimension of hundreds of micrometers has emerged as a distinct new field. In this paper, devices modeling and FEM simulation using Comsol Multiphysics of the fluid-structure interaction applied to PDMS micro-bridge deflection study under various fluid flow rates are presented. The introducing of fluid flow into the micro-channel causes the deflection of the microbridge. The simulation results predict a sensitive bending for low flow rate with an adapted micro-bridge dimension for each micro-channel depth. Thus demonstrate the feasibility of a new concept and open a new area of research in micro-fluidic devices and BioMEMS sensing to obtain higher sensitivity with low fluid flow rate, low coast and low power consumption.
  • Keywords
    bending; finite element analysis; flexible electronics; microchannel flow; polymers; semiconductor device models; Comsol Multiphysics; FEM simulation; PDMS microbridge deflection; PDMS microchannel depth; bioMEMS sensing; device modeling; flexible microbridge bending; fluid flow manipulation; fluid flow rate; fluid-structures interaction; microfluidic device; polydimethylsiloxane; sensitive bending; Finite element analysis; Fluid flow; Fluids; Sensitivity; Sensors; Young´s modulus; FEM simulation; PDMS; Young´s modulus; bending; fluid flow; micro-bridge; micro-channel; modeling; polydimethylsiloxane;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Type

    conf

  • DOI
    10.1109/SMELEC.2014.6920906
  • Filename
    6920906