• DocumentCode
    1156758
  • Title

    Using STEAM for Thermal Simulation of Storage Systems

  • Author

    Gurumurthi, Sudhanva ; Kim, Youngjae ; Sivasubramaniam, Anand

  • Author_Institution
    Dept. of Comput. Sci., Virginia Univ., Charlottesville, VA
  • Volume
    26
  • Issue
    4
  • fYear
    2006
  • Firstpage
    43
  • Lastpage
    51
  • Abstract
    As demands for higher data transfer rates mount, temperature is joining bandwidth and latency as a key consideration in storage system design. The STEAM simulator lets users abstract the details of low-level recording physics and heat transfer phenomena and facilitates exploration of a large design space of storage configurations under realistic workloads
  • Keywords
    digital simulation; disc drives; memory architecture; STEAM simulator; data transfer rate; heat transfer phenomena; low-level recording physics; storage system design; thermal simulation; Arm; Computational modeling; Cooling; Costs; Discrete event simulation; Disk drives; Heat transfer; Solid modeling; Temperature; Thermal conductivity; STEAM; data transfers; heat transfer; storage systems design; thermal simulation;
  • fLanguage
    English
  • Journal_Title
    Micro, IEEE
  • Publisher
    ieee
  • ISSN
    0272-1732
  • Type

    jour

  • DOI
    10.1109/MM.2006.84
  • Filename
    1677502
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1156758