• DocumentCode
    1157221
  • Title

    Proposal of field-emission device surrounded by high-k dielectric and performance prospects

  • Author

    Omura, Yasuhisa ; Murashima, Kensuke

  • Author_Institution
    Graduate Sch. of Eng., Kansai Univ., Osaka
  • Volume
    2
  • Issue
    3
  • fYear
    2006
  • Firstpage
    300
  • Lastpage
    306
  • Abstract
    We propose a field-emission device surrounded by high-k dielectric (FESH) that used a Spindt-type emitter; its design guidelines are demonstrated using various device parameters. The most significant aspect of the FESH structure is its use of high-k dielectric material to surround the emitter. The large dielectric constant of the high-k dielectric dramatically reduces the threshold voltage when applying dc voltage. It is shown that the most suitable device parameters can be extracted from the viewpoint of figure-of-merit. When dc voltage is applied to a FESH device, a large transient current flows between the anode and the cathode. The application of an ac voltage eliminates the current leakage that would otherwise hinder the development of practical applications such as displays. It is demonstrated from dynamic simulations that sinusoidal input pulses should be applied to FESH devices rather than rectangular input pulses since the former realizes the benefits of low-power operation and high reliability
  • Keywords
    dielectric materials; field emission displays; leakage currents; low-power electronics; permittivity; FESH device; Spindt-type emitter; ac voltage; current leakage; dielectric constant; field-emission device; high-k dielectric material; threshold voltage reduction; transient current; Anodes; Capacitance; Cathodes; Computer displays; Conducting materials; Dielectric devices; Electrodes; Guidelines; Proposals; Voltage; Cut-off frequency; Spindt-type emitter; dynamic performance; field-emission device; figure-of-merit (FOM); high-; low threshold;
  • fLanguage
    English
  • Journal_Title
    Display Technology, Journal of
  • Publisher
    ieee
  • ISSN
    1551-319X
  • Type

    jour

  • DOI
    10.1109/JDT.2006.879841
  • Filename
    1677556