DocumentCode
1159510
Title
High-
Transformers in Copper-Interconnection CMOS Technology
Author
Hsu, Heng-Ming ; Chien, Hung-Chi
Author_Institution
Dept. of Electr. Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
Volume
32
Issue
3
fYear
2009
Firstpage
578
Lastpage
584
Abstract
This paper proposes the adoption of aluminum-pad (AL-pad) film to improve the performance of on-chip transformers using current CMOS technology. Two devices proposed in this paper use an AL-pad film, without adding extra process, to enhance the Q value and bandwidth in the copper-interconnection process. The first device changes the transformer´s coil location to increase the peak Q value and operation bandwidth, and the second device alters the coil material to improve the Q value in the entire operating band. A foundry 0.13-??m CMOS technology is fabricated the proposed transformers. The measurement results demonstrate that the first proposed device improves the peak Q value and operation bandwidth with the values of 32.5% and 22.6%, respectively. Afterward, the second proposed device increases the peak Q value 44.7% more than the standard device.
Keywords
CMOS integrated circuits; Q-factor; aluminium; copper; integrated circuit interconnections; transformers; Al; CMOS technology; Cu; aluminum-pad film; copper-interconnection process; high-Q value; on-chip transformer; size 0.13 mum; ${Q}$ value; Aluminum-pad; copper-interconnection; on-chip transformer; silicon-based; stack layout;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2008.2009226
Filename
4783100
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