• DocumentCode
    1163102
  • Title

    Signal analysis methods to distinguish tracking process using time-frequency analysis

  • Author

    Jee, Seung-Wook ; Lee, Chun-Ha ; Lee, Kwang-Sik

  • Author_Institution
    Boo-sung Co. Daegu-si, Daegu
  • Volume
    16
  • Issue
    1
  • fYear
    2009
  • fDate
    2/1/2009 12:00:00 AM
  • Firstpage
    99
  • Lastpage
    106
  • Abstract
    This paper proposes a method to distinguish the tracking process only in terms of voltage waveforms. Tracking is simulated using the IEC (International Electrotechnical Commission) 60112 method. The tracking process is observed in 5 stages - static state, discharge inception, discharge in progress, carbon formation, and tracking breakdown. The measured voltage waveforms are analyzed by two signal processes. The two kinds of signal processing are: improved time-frequency and time-energy analysis. The tracking process can be distinguished by using the improved time-frequency analysis visually by stages. It can also be distinguished by using average and standard deviation for the results of the time-energy analysis. Particularly, probability distribution for the result of the time-energy analysis appears a regular pattern in tracking process by stages.
  • Keywords
    IEC standards; insulation testing; probability; signal processing; surface discharges; time-frequency analysis; voltage measurement; IEC 60112 method; International Electrotechnical Commission; carbon formation; discharge inception; discharge-in-progress; probability distribution; signal analysis method; signal processing method; static state; time-energy analysis; time-frequency analysis; tracking breakdown; tracking process; voltage waveform measurement; Bridge circuits; Electric breakdown; Electrodes; IEC standards; Insulation life; Probability distribution; Signal analysis; Signal processing; Time frequency analysis; Voltage measurement; Fourier transforms, time-frequency analysis, tracking.;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2009.4784556
  • Filename
    4784556