DocumentCode
1173516
Title
Compositional and failure analysis of polymers - a practical approach [Book Review]
Volume
19
Issue
2
fYear
2003
Firstpage
46
Lastpage
47
Keywords
Additives; Book reviews; Conducting materials; Conductive adhesives; Curing; Failure analysis; Mechanical factors; Microelectronics; Polymer films; Stability;
fLanguage
English
Journal_Title
Electrical Insulation Magazine, IEEE
Publisher
ieee
ISSN
0883-7554
Type
jour
DOI
10.1109/MEI.2003.1192039
Filename
1192039
Link To Document