• DocumentCode
    1173634
  • Title

    Gate-self-aligned p-channel germanium MISFETs

  • Author

    Jackson, Thomas N. ; Ransom, C.M. ; DeGelormo, J.F.

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
  • Volume
    12
  • Issue
    11
  • fYear
    1991
  • Firstpage
    605
  • Lastpage
    607
  • Abstract
    The authors have fabricated the first gate-self-aligned germanium MISFETs and have obtained record transconductance for germanium FETs. The devices fabricated are p-channel, inversion-mode germanium MISFETs. A germanium-oxynitride gate dielectric is used and aluminum gates, serve as the mask for self-aligned source and drain implants. A maximum room-temperature transconductance of 104 mS/mm was measured for a 0.6- mu m gate length. A hole inversion channel mobility of 640 cm/sup 2//V-s was calculated using transconductance and capacitance data from long-channel devices. This large hole channel mobility suggests that germanium may be an attractive candidate for CMOS technology.<>
  • Keywords
    elemental semiconductors; germanium; germanium compounds; insulated gate field effect transistors; nitridation; semiconductor technology; 0.6 micron; Al gates; CMOS technology; Ge; GeO/sub x/N/sub y/ gate dielectric film; capacitance data; gate length; gate-self-aligned; hole inversion channel mobility; inversion-mode; long-channel devices; p-channel; room-temperature transconductance; self-aligned source; semiconductors; submicron; transconductance; Aluminum; CMOS technology; Capacitance; Dielectric measurements; FETs; Germanium; Implants; Length measurement; MISFETs; Transconductance;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.119212
  • Filename
    119212