• DocumentCode
    1176359
  • Title

    V-T Characteristics of Epoxy Mold Insulation for Sustained AC Voltage

  • Author

    Honda, M. ; Aoyagi, H. ; Koya, M. ; Kobayash, N. ; Tamura, M.

  • Author_Institution
    Toshiba Corporation
  • Issue
    5
  • fYear
    1984
  • fDate
    5/1/1984 12:00:00 AM
  • Firstpage
    1017
  • Lastpage
    1023
  • Abstract
    This paper describes experiments conducted to determine the cause of epoxy mold insulation breakdown under sustained applied AC voltage. It can be readily understood that epoxy mold insulation, widely used as solid insulation in gas-insulated switchgear, is subject to breakdown under sustained applied voltage when the mold insulation contains large voids. However, epoxy mold insulation which is practically void-free also deteriorates under sustained applied voltage. It has been clarified by conducting experiments using various embedded electrode materials that the deterioration of this void-free epoxy mold insulation is primarily caused by an electric field concentration due to micro-protrusions on the embedded electrode surface and a small partial discharge which occurred at minute debonded portions around the micro-protrusions.
  • Keywords
    Breakdown voltage; Conducting materials; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Gas insulation; Insulation testing; Partial discharges; Stress; Switchgear;
  • fLanguage
    English
  • Journal_Title
    Power Apparatus and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9510
  • Type

    jour

  • DOI
    10.1109/TPAS.1984.318706
  • Filename
    4112623