• DocumentCode
    1180089
  • Title

    Chip makers hit heat barrier

  • Author

    Collins, Leslie

  • Volume
    49
  • Issue
    1
  • fYear
    2003
  • Firstpage
    22
  • Lastpage
    23
  • fLanguage
    English
  • Journal_Title
    IEE Review
  • Publisher
    iet
  • ISSN
    0953-5683
  • Type

    jour

  • Filename
    1193720