A test method of SIP module

Author

Tianrui Zhu ; Yun Liang ; Yimao Cai ; Lidong Lan ; Xin Li

Author_Institution

Beijing Microelectron. Technol. Inst., Beijing, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

117

Lastpage

120

Abstract

Developing from IC and PCB, the SIP (system in a package) has already been one of the most important development directions of future electronic system; therefore, we desiderate the study of testing design and test method. Being incapable of adding circuits for testable design, the SIP can only design test method and process according to the existing resources. Test method in this paper takes into account both the IC characteristic and the PCB characteristic of SIP, using the test results of bare dies and substrates in SIP, combined with the SIP production process, identify the steps may cause failure, determine the test projects, and finally complete the test method design. At the same time, consideration has already be given to both test coverage and the cost, it fulfill the actual requirement of SIP.

Keywords

integrated circuit design; integrated circuit testing; printed circuits; system-in-package; IC characteristic; PCB characteristic; SIP module test method; SIP production process; SIP requirement; design test method; dies; electronic system; test coverage; Field programmable gate arrays; Pins; Production; Random access memory; Substrates; Testing; ATE; SIP; functional testing; testing method;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922617

Filename

6922617