DocumentCode
118277
Title
Chip cooling with carbon nanotube heat sink
Author
Zhenlong Huang ; Taisong Pan ; Min Gao ; Yuan Lin
Author_Institution
State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
183
Lastpage
185
Abstract
In this paper, lightweight heat sinks based on carbon nanotubes (CNTs) are presented. CNTs were attached on the surface of silicon chips and their heat dissipation performance were monitored. As the morphology of heat sinks is an important factor for the heat dissipation efficiency, two types of CNTs, CNT arrays and sponge CNTs, were used here. Besides, the influence of airflow on the two kinds of CNTs based heat sink was observed by controlling the wind speed. This work gives an excellent reference for a low-cost and high-performance micro-heat sink in the future.
Keywords
carbon nanotubes; chip scale packaging; cooling; heat sinks; airflow; carbon nanotube heat sink; chip cooling; heat dissipation; lightweight heat sinks; silicon chips; wind speed; Carbon nanotubes; Electrodes; Heat sinks; Resistance heating; Silicon; Temperature sensors; CNT arrays; heat dissipation; heat sink; sponge CNTs;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922632
Filename
6922632
Link To Document