Applications of low temperature sintering technology as die attach for high temperature power modules

Silver-based low temperature sintering technology (LTST) is becoming a promising alternative to bond or joint the large area joints as die attach for high temperature power modules. A review of the silver-sintered die attach technologies will be presented in this paper, as well as a roadmap of challenge of the state-of-the-art silver sintering. Then, highlighted are the methodology of sintering process, the different types and application of sintered Ag paste, the effects of the process parameters on the sintering layer, and the quality evaluations of sintered joints by means of destructive or non-destructive tests. Finally, the applications as well as challenges of silver sintering for high temperature power modules are proposed.