Electrical performance analysis and structure optimization for QFP-48 sockets

In this paper, a 3D model of an existing IC socket used for a QFP packaged chip with 48 pins on a 0.5mm pitch is built in Ansys´s three-dimensional electromagnetic simulation software HFSS. Three different types of pin are simulated and their signal transmission characteristics are analyzed by comparing the simulated S-parameters. On the basis of this socket, a new socket physical model for QFP-48 is proposed with the change of pin´s structure. The simulated S-parameters of the same pins show that the modified socket model has better signal transmission performance and can achieve higher operating frequency. Furthermore, the relationship between this new socket´s relative permittivity and its signal transmission characteristics is analyzed.