• DocumentCode
    1186144
  • Title

    Modeling of tunneling current and gate dielectric reliability for nonvolatile memory devices

  • Author

    Gehring, Andreas ; Selberherr, Siegfried

  • Author_Institution
    Inst. for Microelectron., Tech. Univ. Vienna, Austria
  • Volume
    4
  • Issue
    3
  • fYear
    2004
  • Firstpage
    306
  • Lastpage
    319
  • Abstract
    We present a hierarchy of tunneling models suitable for the two- and three-dimensional simulation of logic and nonvolatile semiconductor memory devices. The crucial modeling topics are comprehensively discussed, namely, the modeling of the energy distribution function in the channel to account for hot-carrier tunneling, the calculation of the transmission coefficient of single and layered dielectrics, the influence of quasi-bound states in the inversion layer, the modeling of static and transient defect-assisted tunneling, and the modeling of dielectric degradation and breakdown. We propose a set of models to link the gate leakage to the creation of traps in the dielectric layer, the threshold voltage shift, and eventual dielectric breakdown. The simulation results are compared to commonly used compact models and measurements of logic and nonvolatile memory devices.
  • Keywords
    electric breakdown; logic devices; semiconductor device reliability; semiconductor storage; tunnelling; device simulation; dielectric degradation; dielectric layer; energy distribution function; gate dielectric breakdown; gate dielectric reliability modeling; gate leakage; inversion layer; logic devices; nonvolatile memory reliability; nonvolatile semiconductor memory devices; quasibound states; static defect-assisted tunneling; threshold voltage shift; transient defect-assisted tunneling; transmission coefficient; tunneling current modeling; Degradation; Dielectric breakdown; Dielectric devices; Distribution functions; Gate leakage; Hot carriers; Logic devices; Nonvolatile memory; Semiconductor memory; Tunneling;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2004.836727
  • Filename
    1369191