• DocumentCode
    118803
  • Title

    Is thermal management outside the package enough for higher LED reliability?

  • Author

    Qi Chen ; Quan Chen ; Run Hu ; Xiaobing Luo

  • Author_Institution
    Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2014
  • fDate
    12-15 Aug. 2014
  • Firstpage
    1068
  • Lastpage
    1070
  • Abstract
    Thermal management has always been crucial for the improving of LED reliability. Most researches focus on the thermal management outside the package like fin optimization, microchannel, microjet cooling, but few refer to the thermal management inside the package. In this paper, a contrast experiment was carried out by an online testing method to explore the LED´s optical degradation under conditions with/without thermal management inside the LED package. Results show that different LED degradation characteristics appear in the experiment and the sample without package-inside thermal management exhibits carbonization phenomenon. Thermal management inside the package should be further reinforced to enhance the reliability of LED package.
  • Keywords
    LED displays; circuit reliability; thermal management (packaging); LED package; carbonization phenomenon; fin optimization; light-emitting diode; microchannel; microjet cooling; online testing method; optical degradation; reliability enhancement; thermal management; Degradation; Electronic packaging thermal management; Light emitting diodes; Phosphors; Reliability; Testing; Thermal management; light-emitting diode; online testing method; reliability; thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
  • Conference_Location
    Chengdu
  • Type

    conf

  • DOI
    10.1109/ICEPT.2014.6922830
  • Filename
    6922830