DocumentCode
118803
Title
Is thermal management outside the package enough for higher LED reliability?
Author
Qi Chen ; Quan Chen ; Run Hu ; Xiaobing Luo
Author_Institution
Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
1068
Lastpage
1070
Abstract
Thermal management has always been crucial for the improving of LED reliability. Most researches focus on the thermal management outside the package like fin optimization, microchannel, microjet cooling, but few refer to the thermal management inside the package. In this paper, a contrast experiment was carried out by an online testing method to explore the LED´s optical degradation under conditions with/without thermal management inside the LED package. Results show that different LED degradation characteristics appear in the experiment and the sample without package-inside thermal management exhibits carbonization phenomenon. Thermal management inside the package should be further reinforced to enhance the reliability of LED package.
Keywords
LED displays; circuit reliability; thermal management (packaging); LED package; carbonization phenomenon; fin optimization; light-emitting diode; microchannel; microjet cooling; online testing method; optical degradation; reliability enhancement; thermal management; Degradation; Electronic packaging thermal management; Light emitting diodes; Phosphors; Reliability; Testing; Thermal management; light-emitting diode; online testing method; reliability; thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922830
Filename
6922830
Link To Document