• DocumentCode
    118844
  • Title

    Effect of package thermal warpage for POP assembling technique

  • Author

    Yabing Zou ; Zhenfeng Zhao

  • Author_Institution
    Reliability Res. & Anal. Center, China Ceprei Lab., Guangzhou, China
  • fYear
    2014
  • fDate
    12-15 Aug. 2014
  • Firstpage
    1142
  • Lastpage
    1145
  • Abstract
    POP stacking technique satisfied the demands of miniaturization, function integration and higher memory space for mobile communication products. However, the warpage of POP package during the soldering procedure will bring the unfavorable effects to quality and reliability of the products. The paper introduces the POP assembling procedure, aims to test and results analysis the effect of package warpage for POP assembling technique, summarizes the measurements for minimizing the package warpage.
  • Keywords
    assembling; product quality; reliability; soldering; thermal management (packaging); POP assembling technique; POP stacking technique; function integration; memory space; mobile communication products; package on package assembling technique; package thermal warpage effect; product quality; product reliability; soldering procedure; Hip; Materials; Reliability; Soldering; Stacking; Temperature measurement; (Head in Pillow) HIP; package on package (POP); shadow moiré; warpage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
  • Conference_Location
    Chengdu
  • Type

    conf

  • DOI
    10.1109/ICEPT.2014.6922845
  • Filename
    6922845
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=118844